AudioQuest Cinnamon USB 3.0 Micro

AudioQuest Cinnamon USB 3.0 Micro

In many applications, the speed of digital communication is important. This is most obvious when you want to transport large files as quickly as possible, or when you want to watch large HD video files. In USB audio (and HDMI audio), speed is not only important to transport as much data as possible as quickly as possible, but even more so because the time relationship within a digital stream is incredibly important in order to be able to reconstruct the analog waveform that must convey all the information, the music and the pleasure we experience from it to our ears.

SOLID 1.25% SILVER CONDUCTORS: Solid conductors eliminate strand-interaction distortion and reduce jitter. Solid silver-plated conductors are excellent for very high-frequency applications, like USB audio. These signals, being such a high frequency, travel almost exclusively on the surface of the conductor. As the surface is made of high-purity silver, the performance is very close to that of a solid silver cable, but priced much closer to solid copper cable. This is an incredibly cost effective way of manufacturing very high-quality USB cables.

HARD-CELL FOAM INSULATION: Hard-Cell Foam insulation is used exclusively in most of AudioQuest’s video and digital audio cables. Similar to Foamed-PE, it is nitrogen injected to create air pockets. “Hard” foam is used because the stiffness of the material allows the conductors in the cable to maintain the same relationship with each other along the entire length of the cable, thus ensuring that the characteristic impedance of the cable is consistent.

ASSEMBLY: The gold plated plugs are carefully assembled with the very best solder. The AQ solder is optimized by making the right choice of flux and metallurgy to make a connection with the least possible distortion. The differences you hear between different types of solder are the result of the quality of the connection made. AQ solder does not have a high silver content because as the silver content in the solder increases, it becomes increasingly difficult to make a good connection.

SUPERSPEED USB 3.0: Utilizes data transfer speeds of up to 4.8Gbps versus a maximum data transfer of 480Mbps for Hi-Speed USB 2.0.